MIL-STD-202F | Sanwood Technology Chip ESSD Test Chamber

In the field of electronic components, reliability is the lifeline that determines whether a product can survive in the fiercely competitive market. Whether it is consumer-grade chips or high-reliability components applied in harsh environments such as military, aerospace, and automotive electronics, their quality must be verified through a series of rigorous environmental stress tests. Sanwood Technology's Chip ESSD test chamber, as a professional environmental simulation testing equipment, fully complies with international standards such as MIL-STD-202F, and can provide strong support for chip reliability verification.

Standard Description

MIL-STD-202F is a US military standard that establishes unified testing methods for electronic and electrical components. Its primary purpose is to ensure that components can withstand the harsh environmental and physical conditions encountered in military and aerospace systems. By subjecting components to these standardized tests, manufacturers and customers can verify their reliability, durability, and performance.

Precise Simulation to Meet Harsh Challenges

Sanwood Technology's Chip ESSD test chamber is specifically designed for ESSD-related testing of chips, integrated circuit boards (BIB boards), and other electronic components. Its core advantages lie in its powerful  load capacity and precise environmental control. The equipment is equipped with up to 12 independent testing shelves, each capable of supporting a 5V/60A input current and a maximum heat load of 2500W (customizable upon customer request). This means that engineers can simultaneously simulate the operating conditions of multiple chips under extreme power within a single unit, significantly improving testing efficiency and shortening product development cycles.

Technical Parameters

Temperature Range: -40°C to +150°C (Actual Upper and Lower Limit >5°C);

Heating Rate: +25°C → +150°C ≥ 3°C/min (non-linear, no load powered);

Cooling Rate: +25°C → -40°C ≥ 3°C/min (non-linear, no load powered);

Temperature Uniformity: ≤ ±3°C (when operating with 20 burn-in boards per chamber);

Temperature Deviation: ≤ ±2°C (when operating with 20 burn-in boards per chamber);

Temperature Fluctuation: ≤ ±0.5°C (when operating with 20 burn-in boards per chamber);

Temperature Stabilization Time: ≤ 10 minutes after the chamber reaches the set point and remains within ±2°C (including direct injection systems).

Advantages and Features

Portable temperature probes for convenient spot-checking of internal chamber temperature accuracy.

Independent switches for each rear-shelf layer, allowing easy power-off operation.

Equipped with RS-485 and Ethernet interfaces, enabling PC connection and communication, with the option for subsequent integration into MES systems.

Automatic door design, compatible with automation mechanisms, ensuring effective space utilization.

Product quality is the lifeline of a enterprise survival and development. Choosing reliable and efficient testing equipment is the most solid line of defense for product quality. Meeting the requirements of stringent testing standards such as MIL-STD-202F, Sanwood Technology's Chip ESSD test chambers, with their professional and reliable performance, have become a trusted testing partner for companies, helping customers gain a crucial advantage in the fiercely competitive market through superior product reliability. In addition to Chip ESSD test chambers, we also offer Thermal Shock Test Chamber -Three-zone and Faster Temperature Humidity Chambers.

For more efficient testing solutions, please contact Sanwood Technology and we will customize a customized environmental testing solution for you.