Views: 8 Author: Sanwood Technology Publish Time: 2025-05-10 Origin: Sanwood Technology
As the semiconductor industry accelerates into the era of 2nm processes, advanced packaging and AI chips, product reliability and stability are facing unprecedented challenges. The precision manufacturing of Extreme Ultraviolet Lithography, the complex structure of 3D IC packaging, and the harsh operating environment of High Bandwidth Memory require semiconductor devices to maintain stable performance under multiple factors including extreme temperature, humidity, and vibration.
As a professional enterprise in the field of environmental test equipment, SANWOOD Technology helps semiconductor companies accelerate the exposure of potential defects with its high-precision environmental simulation technology, providing a important guarantee for the long-term stability of chips.
Semiconductor Industry Pain Points
Integrated Circuit (IC) Chip
IC chips are widely used in processors, memories, logic devices, etc. Their reliability directly affects the stability of electronic equipment.
Test item:
High and low temperature storage test: evaluate the stability of the chip at extreme temperatures, test standards JESD22-A101, GB/T 2423.1/2.
Temperature cycling test: Simulate the thermal stress diurnal temperature or equipment switching on and off, test standard JESD22-A104.
Damp heat test: Evaluate the corrosion resistance of the chip in high humidity environment, test standard GB/T 2423.3.
Power semiconductor (IGBT, MOSFET, etc.)
Power semiconductors are widely used in new energy vehicles, photovoltaic inverters, which need to withstand high voltage, high current and temperature changes.
Test items:
High temperature and high humidity bias test: accelerate assessment of failure modes in humid environments, test standard JESD22-a110, IEC 60749
Optoelectronic devices (LED, laser diode, etc.)
Optoelectronic devices are sensitive to temperature, and high temperature may cause wavelength shift or light attenuation.
Test items:
High temperature aging test: evaluate light attenuation properties, test Standard IEC 62047
Cold and thermal shock test: simulate sudden change of outdoor temperature, test standard JESD22-a106
Salt spray test: evaluate the corrosion resistance in coastal or industrial environment, test standard GB/t 2423.17
Equipment recommendation
Rapid temperature change test chamber
Temperature range: -70 ℃~+150 ℃ (Non-standard customization is available.)
Temperature fluctuation: ≤± 0.5 ℃ (idling and constant state)
Temperature deviation: ≤± 2 ℃ (idling and constant state)
Stress screening Temperature change rate: 5 ℃/Min, 10 ℃/Min, 15 ℃/Min, 20 ℃/Min, 25 ℃/Min
Advanced multi-stage stacked cold balance technology, refrigerant flow control technology effectively achieve energy saving of over 30.
HAST high pressure accelerated aging test chamber
Temperature range: +105℃~+133℃.
Pressure control range：0.5~2.3kg/cm2(0.05~0.23Mpa)
Humidity range: 65%~100%R.H
HAST test conditions have 130℃, 85%RH, 230Kpa atmospheric pressure, 96 hours test time.
Temperature range: -65℃~+150℃
Temperature recovery: 5min
Switching time: ≤10s
R232, R485 output interface, to realize multiple remote monitoring and control
Basket switching time is less than 10 seconds, temperature recovery time is less than 5 minutes.
The reliability of semiconductor products directly affects the performance and life of end devices, and environmental test chambers are a key tool to ensure their quality. By following international and domestic standards, enterprises can systematically verify the environmental adaptability of products and enhance market competitiveness.
With accurate environmental simulation capability and perfect test service system, SANWOOD Technology is committed to providing efficient and reliable test support for customers in the semiconductor sector, helping to improve product performance and safety certification. For more professional test solutions, please contact SANWOOD Technology, we will customize professional services for you.
