Views: 2 Author: Site Editor Publish Time: 2026-08-20 Origin: Sanwood Technology
The SANWOOD Thermal Test System provides localized hot and cold airflow for rapid chip temperature testing and semiconductor failure analysis. This type of equipment is also commonly searched for as a Thermal Stream Tester or temperature forcing system. It applies controlled airflow directly to a specific device under test (DUT) while probes, cables, optical fibers and external instruments remain connected.
This localized approach is useful when a temperature-related fault cannot be isolated by conditioning the entire PCB. Instead of heating or cooling every component, the suspected device can be tested independently while its electrical or optical behavior is monitored.
HBM, computing ICs, optical devices and automotive power components continue to operate at higher power densities and across more demanding temperature conditions. Yet some temperature-related faults remain difficult to reproduce during laboratory testing.
A complete PCB or system may pass an environmental test but later show parameter drift, intermittent errors or unstable operation at the device level. These faults may appear only within a specific temperature range or during a rapid temperature change.
An environmental test chamber controls the temperature of the complete test space. This approach is suitable for modules, PCBs and finished products, but it may not isolate a single temperature-sensitive component. The substrate, connectors, surrounding devices and test fixture all change temperature together, making it more difficult to determine which component is associated with the fault.
For component-level investigation, the suspected DUT often needs to remain connected while a controlled temperature condition is applied directly to it.
The SANWOOD Thermal Test System generates controlled hot and cold airflow in the main unit. The airflow is then delivered to the DUT through a thermal head and suitable temperature-conditioning accessories.
Unlike chamber-level testing, the system concentrates the temperature condition on the target device and its immediate test area. This reduces the amount of material that must be heated or cooled and allows faster movement between test temperatures.
The test setup can use a mechanical arm, thermal head, airflow hood, hose or localized enclosure. These accessories can be selected according to the DUT, fixture and available test space.
Because the temperature is applied locally, probes, electrical cables, optical fibers and external instruments can remain connected during the test. This makes the equipment suitable for powered testing, multi-temperature measurements and the reproduction of temperature-dependent faults.
A Thermal Test System and an environmental test chamber address different levels of temperature testing.
Test consideration | Thermal Test System | |
|---|---|---|
Temperature target | Individual DUT or localized area | Complete PCB, module or product |
Temperature method | Directed hot and cold airflow | Controlled chamber environment |
Instrument access | Probes, cables and fibers remain accessible | Connections normally use access ports |
Typical purpose | Device characterization and fault reproduction | Assembly- and product-level environmental testing |
Test arrangement | Open or locally enclosed DUT setup | Specimen placed inside a controlled workspace |
The two systems are complementary. Chamber-level testing is used when the complete specimen must experience the same environment. Localized airflow is more appropriate when the test objective is to investigate a single device without changing the temperature of the entire PCB.
The system is designed for semiconductor, power device, optical component and electronic module testing.
Parameter | Specification |
Air temperature range | −80°C to +225°C |
Heating transition* | −55°C to +125°C in approximately 10 seconds |
Cooling transition* | +125°C to −55°C in approximately 10 seconds |
Adjustable airflow | 4–18 SCFM, approximately 1.89–8.50 L/s |
DUT temperature feedback | Supports connection to a device temperature sensor |
Temperature delivery | Mechanical arm, thermal head, airflow hood, hose and localized enclosure |
Test integration | Temperature programs, data recording and communication interfaces |
The transition times refer to airflow performance under reference conditions. They do not represent the guaranteed time required for every DUT to reach the target temperature.
The actual DUT response depends on the component, package, fixture, airflow setting and surrounding test arrangement. The device temperature should therefore be measured when stabilization time affects the test result.
Airflow temperature and DUT temperature are not necessarily the same.
The device may require additional time to reach the required condition after the airflow changes. Its temperature response can also be influenced by the package, test fixture and surrounding structure.
The system supports connection to a temperature sensor on or near the DUT. This provides actual device-temperature feedback during the test rather than relying only on the airflow temperature.
DUT temperature feedback helps the test team determine:
Whether the device has reached the required temperature
When electrical or optical measurements should begin
At what temperature an intermittent fault appears
Whether repeated test runs use comparable conditions
The sensor position and installation method should remain consistent when results from different temperature points or test runs are compared.
A common application involves a device that operates normally at room temperature but becomes unstable when heated or cooled.
The thermal head can be positioned over the suspected component while the PCB remains connected to external instruments. During the test, the relevant electrical or optical parameters can be monitored as the device moves through different temperature points.
If the same fault appears repeatedly within a similar DUT temperature range, the result can help narrow the investigation. Further electrical inspection or physical analysis can then focus on the affected component and its connections.
A typical test sequence may include:
Reproduce the original electrical or optical symptom.
Position the thermal head and DUT temperature sensor.
Apply the required temperature points to the target device.
Monitor the relevant operating parameters.
Record the DUT temperature when the symptom appears.
Repeat the sequence to confirm that the behavior is temperature dependent.
The system does not identify a physical defect by itself. It provides a controlled way to reproduce temperature-related behavior during semiconductor failure analysis.
The Thermal Test System can be used with ICs, ASICs, FPGAs, memory devices and power components. Typical work includes temperature characterization, parameter verification, fault reproduction and testing with automatic test equipment.
Because the DUT remains accessible, the test team can maintain electrical connections and observe how device behavior changes at different temperature points.
For advanced packages and HBM-related devices, the test arrangement should be selected according to package structure, fixture access and sensor position. The purpose of the localized airflow is to create a controllable device-level temperature condition, not to reproduce the thermal behavior of an entire operating system.
Power devices may show changes in electrical behavior at different temperatures. IGBTs and other high-power components can remain connected to suitable power and measurement equipment while the package is heated or cooled locally.
Depending on the test objective, the system can support device characterization, rapid temperature changes, thermal overstress testing and temperature-related fault investigation.
The power supply, fixture and protection measures should be configured according to the DUT and the intended test.
Optical modules, transceivers, lasers and detectors often need to remain connected to optical fibers and measurement instruments throughout the test.
Localized airflow allows the test area to remain accessible while parameters such as wavelength, optical power, sensitivity and electrical performance are measured at different temperatures.
This arrangement is useful when placing the complete optical test setup inside an environmental chamber would make access or connection more difficult.
The same test method can be applied to temperature-sensitive components in automotive electronics, assembled PCBs and sensor systems.
For ECUs, sensors, power modules and connectors, it can help investigate functional limits and faults that occur only at certain temperatures. On assembled PCBs, localized airflow can be directed to a suspected device without heating or cooling the complete board.
Temperature, pressure and inertial sensors can also be evaluated at multiple temperature points for drift, zero offset, sensitivity and compensation parameter work.
The suitability of the setup depends on DUT accessibility, fixture design and the measurement objective.
The temperature program, data recording and communication interface can be integrated into laboratory or production test platforms.
This allows the temperature sequence to be coordinated with external measurement equipment. The DUT can remain connected while temperature and operating data are collected during the same test process.
The thermal head, airflow hood, hose and local enclosure should be selected according to the device size, test position and required access. A suitable arrangement helps direct the airflow to the DUT and supports repeatable sensor placement.
Thermal Stream Tester is a commonly used industry and search term for equipment that directs hot and cold airflow to a DUT. SANWOOD uses Thermal Test System as the formal equipment name.
Not in every application. A Thermal Test System is intended for an individual device or localized test area. An environmental test chamber is more suitable when a complete PCB, module or product must experience the same controlled environment.
Typical DUTs include ICs, ASICs, FPGAs, memory devices, IGBTs, optical modules, lasers, detectors, automotive electronic components, PCB-mounted devices and sensors.
For semiconductor laboratories, device manufacturers and failure analysis teams, the SANWOOD Thermal Test System provides localized temperature conditioning when one DUT must be tested without changing the temperature of the entire PCB. Its −80°C to +225°C air temperature range, adjustable 4–18 SCFM airflow and DUT temperature feedback support rapid chip temperature testing, device characterization and temperature-related failure analysis.
Defining the DUT and test interface before equipment selection helps establish a configuration suited to the actual measurement task.
